| PART |
Description |
Maker |
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV817 LTV827 LTV847 |
HIgh Density Mounting Type Photocoupler
|
TMT[Taiwan Memory Technology]
LITEON
|
| PC818 |
High Density Mounting Type Photocoupler
|
Sharp Electrionic Components
|
| LTV847M-V LTV847-V LTV847S-V LTV-817 LTV817-V LTV8 |
High Density Mounting Type Photocoupler
|
Shenzhen Tenand Technology Co., Ltd.
|
| LTV817 LTV817M |
High Density Mounting Type Photocoupler(484.19 k)
|
LITE-ON
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| IS357B |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| HCPL-817 HCPL-817-0 HCPL-817-3 HCPL-817-5 HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type 光电晶体管光电耦合器高密度安装类型
|
TE Connectivity, Ltd.
Avago Technologies, Ltd.
Diodes, Inc.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
|
| TIL199A |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
N.A.
|
| IS357A |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
ISOCOM
|
| LTV-355T |
Hybrid substrates that require high density mounting Programmable controllers
|
光宝科技股份有限公司
Lite-On Technology Corporation
|
